Corporate Events

Teradyne, Inc. announced an integrated test cell solution supporting known good device screening for devices used in AI and data center applications, developed in collaboration with Tokyo Electron. The solution pairs Teradyne’s UltraFLEXplus platform with Tokyo Electron’s Prexa SDP (Singulated Device Prober) to provide fabless designers, foundries, and OSATs a production-ready path to high-quality device screening at multiple points in the advanced packaging flow. Teradyne and Tokyo Electron have collaborated to deliver an integrated test cell solution supporting known good device screening for devices used in AI and data center applications. The solution pairs Teradyne’s UltraFLEXplus platform with Tokyo Electron’s Prexa SDP to provide fabless designers, foundries, and OSATs a production-ready path to high-quality device screening at multiple points in the advanced packaging flow. As AI and data center device architectures increasingly adopt chiplet-based designs that integrate multiple die into a single 2.5D or 3D package, a single defective die can compromise the entire high-value package. Adding known good device screening is essential to protecting final yield, improving quality, and maximizing output. The joint solution between Teradyne and Tokyo Electron delivers a validated test cell designed to reduce integration risk for high-volume manufacturing. Within the test cell, Teradyne’s UltraFLEXplus instruments coordinate with Tokyo Electron’s PrexaSDP, which maintains device temperature and manages the high-power dissipation characteristics typical of leading-edge AI silicon. Built on an open ecosystem architecture, the solution provides customers with flexibility across complementary probe cards, manipulators, and interface technologies, and can be integrated with other probers or testers as required. The commercially available solution, developed by Teradyne in collaboration with Tokyo Electron, represents a significant advancement in meeting the rigorous demands of AI and data center device manufacturing. By combining Teradyne's UltraFLEXplus platform with Tokyo Electron's Prexa SDP prober, customers gain access to a robust, production-ready known good device screening solution that helps ensure advanced 2.5D and 3D packages achieve the reliability and performance required for next-generation AI and data center architectures.

The Board of Directors of Tokyo Electron Limited has authorized a buyback plan on May 29, 2026.

Tokyo Electron Limited (TSE:8035) announces a share repurchase program. Under the program, the company will repurchase up to 7,500,000 shares, representing 1.64% of its issued share capital, for ¥150,000 million. The purpose of the program is to implement growth investments aimed at mid- to long-term profit growth, while also considering the company's current cash position. The program is valid till March 31, 2027. As of April 30, 2026, the company had 456,158,362 outstanding shares (excluding treasury stock) and 11,874,371 treasury shares.

Tokyo Electron Limited, Board Meeting, May 29, 2026. Agenda: To consider Evaluation of the Effectiveness of Tokyo Electron's Board of Directors; and to consider and approve the Establishment of a Share Repurchase Facility.

Tokyo Electron Ltd. (TEL) announced that on May 29, 2026, its Board of Directors has resolved to implement a stock split, corresponding partial amendment to the Articles of Incorporation, as below. In accordance with the provisions of the Article 184, Paragraph 2 of the Companies Act, the company will change the total number of authorized shares stipulated in Article 6 of the Articles of Incorporation as of October 1, 2026, in response to the implementation of the stock split. Current Articles of Incorporation: Article 6 Total Number of Authorized Shares The total number of shares the Company is authorized to issue shall be nine hundred million (900,000,000) shares. Amendments: Article 6 Total Number of Authorized Shares The total number of shares the Company is authorized to issue shall be four billion five hundred million (4,500,000,000) shares. Effective date of amendment of the Articles of Incorporation October 1, 2026 .

Tokyo Electron Limited declared dividend of JPY 364 per share for the fiscal year ended March 31, 2026 as compared to JPY 327 per share a year ago. Payable on June 2, 2026.

The company closed its plan on March 9, 2026.

From February 6, 2026 to March 9, 2026, the company has repurchased 3,620,400 shares, representing 0.79% for ¥149,997.45 million. With this, the company has completed the repurchase of 3,620,400 shares, representing 0.79% for ¥149,997.45 million under the buyback announced on February 6, 2026.

Tokyo Electron Limited, Board Meeting, Mar 27, 2026. Agenda: To consider Notice of Cancellation of Treasury Stock.

Tokyo Electron Limited announced that they will report fiscal year 2026 results at 4:00 PM, Tokyo Standard Time on Apr 30, 2026

Tokyo Electron Limited Presents at Morgan Stanley Technology, Media & Telecom Conference 2026, Mar-02-2026 . Venue: The Palace Hotel, San Francisco, California, United States.

Tokyo Electron Limited expected to report Fiscal Year 2026 results on April 30, 2026. This event was calculated by S&P Global (Created on February 9, 2026).

The Board of Directors of Tokyo Electron Limited has authorized a buyback plan on February 6, 2026.

Tokyo Electron Limited, Board Meeting, Feb 06, 2026. Agenda: To acquire its resolved to acquire its own shares under the provisions of its Articles of Incorporation pursuant to paragraph 1, Article 459.

Tokyo Electron Limited announced that they will report Q3, 2026 results on Feb 06, 2026

Morgan Stanley, Morgan Stanley Technology, Media & Telecom Conference 2026, Mar 02, 2026 through Mar 05, 2026. Venue: The Palace Hotel, San Francisco, California, United States.

Tokyo Electron Limited revised consolidated earnings guidance for the fiscal year ending March 31, 2026. for the year, the company expects net sales of JPY 2,380,000 million, operating income of JPY 586,000 million, net income attributable to owners of parent of JPY 488,000 million and net income per share of JPY 1,064.77 against net sales of JPY 2,350,000 million, operating income of JPY 570,000 million, net income attributable to owners of parent of JPY 444,000 million and net income per share of JPY 969.12 expected previously.

Tokyo Electron Limited, Q2 2026 Earnings Call, Oct 31, 2025

Tokyo Electron Limited announced that they will report Q2, 2026 results on Oct 31, 2025

Tokyo Electron Limited Presents at Morgan Stanley Asia BEST Corporate Day, Sep-24-2025 . Venue: New York, United States.

Tokyo Electron Limited Presents at Semicon West 2025, Oct-07-2025 01:00 PM. Venue: Phoenix Convention Center 100 N 3rd St, Phoenix, Arizona, United States. Speakers: Aki Sekiguchi, Fellow, Jack Ishida, CO*, SVP & GM, Frontend Process, Keiichi Akiyama, Senior VP, GM of Backend Process Business Division, Division Officer of BPBD & Corporate Officers, Tony Kawai, President & CEO.

Morgan Stanley, Morgan Stanley Asia BEST Corporate Day, Sep 24, 2025. Venue: New York, United States.

Resonac Corporation announced the establishment of ‘JOINT3,’ a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc. These companies, all significant global leaders in the semiconductor supply chain, will jointly develop materials, equipment, and design tools optimized for panel-level organic interposers--semiconductor packaging technology that utilizes organic materials to create a bridge between different components on a circuit board--using a prototype production line for the manufacture of 515 x 510mm panel-level organic interposer. The number of interposers obtainable from a circular wafer and a square panel. Resonac will establish an ‘Advanced Panel Level Interposer Center (APLIC)’ as the main hub for this initiative within its Shimodate Plant (Minami-yuki) in Yuki City, in Japan's Ibaraki Prefecture. APLIC will house the prototype production line, which is scheduled to commence operations in 2026. Here, the Consortium will accelerate development efforts by delivering verification results that closely mirror real-world structures. In recent years, packaging for back-end processes has emerged as a key technology in the field of next-generation semiconductors. This includes 2.xD packages, whereby multiple semiconductor chips are arranged in parallel and connected via interposers, demand for which is expected to grow in line with the need for increased data communication capacity and speed. As semiconductor performance improves, interposers are becoming larger, and there is a shift from silicon interposers to organic interposers made from organic materials. Conventional manufacturing methods involve cutting rectangular pieces from circular wafers. However, as interposers increase in size, the number of them that can be obtained from a single wafer decreases, posing a significant challenge. To address this issue, a manufacturing process that transitions from circular waferapes to square panel shapes is gaining attention, as it allows for an increased number of interposers to be produced from a given area of wafer. As leader of the JOINT3 consortium, Resonac will propose R&D priorities, managing the operation of the prototype production line and driving the overall progress of the initiative. Through co-creation with participating companies, Resonac will also promote the development of materials optimized for panel-level organic Interposers. Participating Companies (listed in alphabetical order) 27 companies (as of September 3, 2025) Resonac Corporation, AGC Inc., Applied Materials, Inc. ASMPT Singapore Pte. Ltd., Brewer Science, Inc., Canon Inc. Comet Yxlon GmbH, EBARA Corporation, Furukawa Electric Co., Ltd. Hitachi High-Tech Corporation, JX Advanced Metals Corporation Kao Corporation, Lam Research Salzburg GmbH LINTEC Corporation, MEC COMPANY LTD., Mitutoyo Corporation NAMICS Corporation, Nikko-Materials Co., Ltd. OKUNO CHEMICAL INDUSTRIES CO., LTD. Synopsys, Inc., Tokyo Electron Ltd., Tokyo Ohka Kogyo Co., Ltd. TOWA Corporation, ULVAC, Inc., Ushio Inc. ZUKEN Inc., 3M Company.

Tokyo Electron Limited revised year end dividend guidance for the fiscal year ended March 31, 2025. for the year end, the company expects dividend of JPY 240.00 per share against JPY 373.00 per share expected previously.

Tokyo Electron Limited revised consolidated earnings guidance for the fiscal year ending March 31, 2026. for the year, the company expects net sales of JPY 2,350,000 million, operating income of JPY 570,000 million, net income attributable to owners of parent of JPY 444,000 million and net income per share of JPY 969.12 against net sales of JPY 2,600,000 million, operating income of JPY 727,000 million, net income attributable to owners of parent of JPY 566,000 million and net income per share of JPY 1,235.51 expected previously.

Tokyo Electron Limited provided consolidated earnings guidance for the six months ending September 30, 2025. For the six months, the company expects net sales of JPY 1,150,000 million, operating income of JPY 288,000 million, net income attributable to owners of parent of JPY 224,000 million and net income per share of JPY 488.93.

Tokyo Electron Limited, Board Meeting, Jul 31, 2025. Agenda: To continue the stock delivering scheme for TEL Group Officers in Japan and Abroad.

Tokyo Electron Limited expected to report First-Half, 2026 results on November 12, 2025. This event was calculated by S&P Global (Created on July 31, 2025).

Tokyo Electron Limited, Q1 2026 Earnings Call, Jul 31, 2025

Tokyo Electron Limited announced that they will report Q1, 2026 results at 4:00 PM, Tokyo Standard Time on Jul 31, 2025

Tokyo Electron Limited, Board Meeting, Jun 17, 2025. Agenda: To issue stock options for stock-based compensation (share subscription rights).