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2025-06-25
TOKYO SEIMITSU CO., LTD. (the Company) announced that the meeting of the board of directors held on June 23, 2025, ratified a transfer of corporate representative directors: Transfer of Representative Directors: Hitoshi YOSHIDA: Current: Chairman, Representative Director and CEO; New: Chairman, Representative Director. Ryuichi KIMURA: Current: President and COO; New: President and CEO. Effective date is June 23, 2025.
2025-06-25
TOKYO SEIMITSU CO., LTD. (the Company) announced that the meeting of the board of directors held on June 23, 2025, ratified a transfer of corporate representative directors: Transfer of Representative Directors: Ryuichi KIMURA: Current: President and COO; New: President and CEO. Effective date is June 23, 2025.
2025-06-23
Tokyo Seimitsu Co., Ltd., Board Meeting, Jun 23, 2025. Agenda: To ratify a transfer of corporate representative directors.
2025-05-27
Tokyo Seimitsu Co., Ltd. provided dividend guidance for interim end and full year end of FY2026/3 Ending March 31, 2026. For interim period, the company expects dividend to ¥107 per share. For the year end the company expects dividend to ¥107 per share.
2025-05-26
Tokyo Seimitsu Co., Ltd. provided consolidated earnings guidance for interim and full year of FY2026/3 ending March 31, 2026. For the interim basis, the company expects Sales to be JPY 78,500 million. Operating Profit to be JPY 15,200 million. For full year, company expects Sales to be JPY 159,000 million million. Operating Profit to be JPY 31,000 million.
2025-05-26
Tokyo Seimitsu Co., Ltd. announced dividend for year end of FY2025/3. For the year end, company announced dividend of ¥139 per share.
2025-05-14
As announced in the " Notice of Establishment of Joint Venture Company" dated April 24, 2025, announced that it has established a joint venture company with Tokyo Seimitsu Co. Ltd. to develop, manufacture, and sell hub blades, one of the dicing blades used for dicing machines. Dicing blades used in dicing machines are classified into several types depending on their applications and materials, of which the largest market is for hub blades, which are mainly used for cutting silicon wafers. In order to provide customers with hub blades that meet their needs quickly, two companies decided to established a joint venture to develop, manufacture, and selling hub blades, one of the Dicing blades used for dicing machine. Dicing blades used in Dicing machines are classified into several type depending on their applications and materials. In order to provide customers With hub blades that meet their needs rapidly, two companies decided to established an joint venture to develop, manufacture and sell hub blades.
2025-05-09
Tokyo Seimitsu Co., Ltd., Annual General Meeting, Jun 23, 2025, at 10:00 Tokyo Standard Time. Location: "Sho-oh," 5th Floor, Keio Plaza Hotel Hachioji located at 14-1, Asahi-cho, Hachioji, Tokyo Japan Agenda: To consider The Business Report, the Consolidated Financial Statements for the Company's 102nd Fiscal Year (April 1st, 2024 March 31st, 2025) and the results of audits by the Accounting Auditor and the Audit and Supervisory Committee of the Consolidated Financial Statements; The Non-Consolidated Financial Statements for the Company's 102nd Fiscal Year (April 1st, 2024 March 31st, 2025); and to discuss other matters.
2025-04-24
Asahi Diamond Industrial Co., Ltd. announced that Board of Directors has resolved at a meeting held on March 28, 2024 to establish a joint venture company with Tokyo Seimitsu Co., Ltd. to develop, manufacture and sell hub blades, one of the dicing blades used for dicing machines. Dicing blades used in dicing machines are classified into several types depending on their applications and materials, of which the largest market is for hub blades, which are mainly used for cutting silicon wafers. In order to provide customers with hub blades that meet their needs quickly, two companies decided to established a joint venture to develop, manufacture, and sell hub blades. Overview of the joint venture. The name, the Location, the Title and name of representative, TBD, and the Investment ratio have yet to be decided. They will be announced promptly once they have been decided.
2025-03-28
Tokyo Seimitsu Co., Ltd. - Special Call
2025-02-06
Tokyo Seimitsu Co., Ltd. announced that they will report fiscal year 2025 results on May 09, 2025
2025-01-09
Tokyo Seimitsu Co., Ltd. expected to report Fiscal Year 2025 results on May 9, 2025. This event was calculated by S&P Global (Created on January 9, 2025).
2025-01-08
Tokyo Seimitsu Co., Ltd., Q3 2025 Earnings Call, Feb 04, 2025
2024-12-06
Tokyo Seimitsu Co., Ltd. announced that they will report Q3, 2025 results at 3:30 PM, Tokyo Standard Time on Feb 04, 2025
2024-11-07
Tokyo Seimitsu Co., Ltd. announced revision of Interim Dividend and year end dividend of fiscal year ending March 31, 2025. The company now announced interim dividend of JPY 114.00 per share as compared to JPY 108.00 per share announced previously. Effective date of distribution December 9th, 2024. For the full year, the company now forecasts dividend of JPY 114.00 Yen as compared to JPY 108.00 per share forecasted previously.
2024-11-02
Tokyo Seimitsu Co., Ltd. expected to report Q3 2025 results on January 31, 2025. This event was calculated by S&P Global (Created on November 1, 2024).
2024-10-01
Tokyo Seimitsu Co., Ltd., H1 2025 Earnings Call, Nov 01, 2024
2024-09-13
Tokyo Seimitsu Co., Ltd. announced that they will report Q2, 2025 results at 3:00 PM, Tokyo Standard Time on Nov 01, 2024
2024-09-11
Tokyo Seimitsu Co., Ltd., Board Meeting, Sep 11, 2024. Agenda: To consider and approve to dispose the Company’s treasury stock in association with the introduction of a new performance-linked stock compensation plan called the Board Benefit Trust.
2024-08-07
Tokyo Seimitsu Co., Ltd. provides dividend guidance for the FY2025/3 Ending March 31st, 2025, announces dividend for FY2024/3 ended March 31st, 2024. For the period ending March 31st, 2025 the company expects dividend of JPY 108.00 per share and for year end JPY 108.00 per share. For the period ending March 31st, 2024 the company announced dividend of JPY 89.00 per share and for year end JPY 103.00 per share.
2024-08-07
Tokyo Seimitsu Co., Ltd. revised earnings guidance for the period ending April 1st, 2024 - September 30th, 2024. For the period ending April 1st, 2024 - September 30th, 2024 the company expects Net Sales to be JPY 70,000 million. Operating Profit to be JPY 13,000 million. Net Profit to be attributable to owners of the parent to be JPY 12,000 million. Net Profit per Share to be 296.69.
2024-08-07
Tokyo Seimitsu Co., Ltd. provided earnings guidance for the period ending April 1st, 2024 - March 31st, 2025. For the period ending April 1st, 2024 - March 31st, 2025 the company expects Net Sales to be JPY 143,000 million. Operating Profit to be JPY 27,000 million. Net Profit to be attributable to owners of the parent to be JPY 21,800 million. Net Profit per Share to be 538.95.
2024-08-02
Tokyo Seimitsu Co., Ltd. expected to report Q2 2025 results on November 1, 2024. This event was calculated by S&P Global (Created on August 2, 2024).
2024-07-17
Tokyo Seimitsu Co., Ltd., ¥ 108., Cash Dividend, Sep-27-2024
2025Q1 | 2024Q4 | 2024Q3 | 2024Q2 | 2024Q1 | 2023Q4 | 2023Q3 | |
|---|---|---|---|---|---|---|---|
Total Revenues | 150,534 | 148,922 | 142,582 | 137,688 | 134,680 | 132,582 | 139,262 |
Pretax Income Excl.Unusual Items | 29,939 | 31,208 | 27,532 | 26,128 | 26,510 | 26,749 | 30,864 |
Total Assets | 237,952 | 230,292 | 232,602 | 225,271 | 225,524 | 216,986 | 205,524 |
Total Liabilities | 61,725 | 62,211 | 64,072 | 66,666 | 67,099 | 67,882 | 54,993 |
Cash & Cash Equivalents | 54,541 | 53,023 | 58,741 | 38,623 | 36,782 | 35,055 | 28,154 |
Total Common Equity | 175,171 | 167,196 | 167,681 | 157,786 | 157,641 | 148,304 | 149,758 |
Book Value Per Share (BVPS) | 4,328.97 | 4,132.5 | 4,144.64 | 3,900.61 | 3,902.07 | 3,674.14 | 3,711.05 |
Net Change in Cash | 17,779 | 30,203 | -3,299 | -16,641 | |||
Capital Expenditure | -9,574 | -7,891 | -9,845 | -9,216 |
On June 20, 2025, Tokyo Seimitsu shared its financial results for the first quarter of 2025, with revenues of 47.4B yen and net income of 7.51B yen, indicating a growth of 3.5% in revenue, along with a slight decrease of approximately 15.2% in EPS compared to the same quarter last year. A positive note is that for the 5th consecutive quarter, the company's revenue line has increased compared to last year's corresponding quarter, which demonstrates the company's stability and its ability to grow in the future.
In addition, the EBITDA margin moderate decline from 26.4% in the corresponding quarter last year to 25.1%. The dividend yield for this stock is approximately 2.3%, and it trades at 15.2x times current year's earnings, which is higher than the sector average (P/E 15x).