Corporate Events

Lasertec Corporation announced the appointment of Hiroki Miyai as Executive Officer concurrently, General Manager, Technology Department 5, previously he was General Manager,Technology Department 5, Effective April 1, 2025.

Lasertec Corporation announced that they will report Q3, 2025 results on Apr 28, 2025

Lasertec Corporation, Q3 2025 Earnings Call, Apr 28, 2025

Lasertec Corporation Presents at Morgan Stanley Technology, Media & Telecom Conference, Mar-06-2025 10:45 AM. Venue: Palace Hotel, San Francisco, California, United States. Speakers: Masashi Sunako, Lasertec USA President, Osamu Okabayashi, Executive Officer & Executive Chairman.

Lasertec Corporation, ¥ 173., Cash Dividend, Jun-27-2025

Lasertec Corporation expected to report Q3 2025 results on April 28, 2025. This event was calculated by S&P Global (Created on January 31, 2025).

Lasertec Corporation announced that they will report Q2, 2025 results on Jan 31, 2025

Morgan Stanley, Morgan Stanley Technology, Media & Telecom Conference, Mar 03, 2025 through Mar 06, 2025. Venue: Palace Hotel, San Francisco, California, United States.

Lasertec Corporation Presents at KIS Global Investors Conference 2024, Nov-11-2024 . Venue: Conrad Seoul Hotel (Yeouido), 10 Gukjegeumyung-ro, Yeongdeungpo District, Chooncheon, South Korea.

Lasertec Corporation, Q2 2025 Earnings Call, Jan 31, 2025

Korea Investment & Securities Co., Ltd., KIS Global Investors Conference 2024, Nov 11, 2024. Venue: Conrad Seoul Hotel (Yeouido), 10 Gukjegeumyung-ro, Yeongdeungpo District, Chooncheon, South Korea.

Lasertec Corporation, ¥ 115., Cash Dividend, Dec-27-2024

Lasertec Corporation expected to report First-Half, 2025 results on January 30, 2025. This event was calculated by S&P Global (Created on October 2, 2024).

Lasertec Corporation, Board Meeting, Sep 26, 2024. Agenda: To consider change in Representative Directors.

Lasertec Corporation announced the release of SICA108, the latest model of its SiC wafer inspection and review systems. Featuring both surface and photoluminescence (PL) inspection capabilities in one body, SICA108 enables customers to concurrently perform high-speed inspection and high-accuracy classification of surface defects as well as crystallographic defects. SiC power devices are used in a variety of applications, including electric vehicles, air conditioners, solar cells, and railway cars, and facilitate the realization of a carbon-neutral society. However, SiC wafer production processes are technically demanding, and there are still many defects that impact device yields. It therefore remains a challenge to manufacture high-quality SiC wafers stably at a lower cost. Lasertec has released SICA108 to help overcome this challenge. Renewing the inspection optics from SICA88, the current de facto standard tool widely used among many customers, SICA108 provides higher throughput and improved performance in quality analysis of SiC wafers with a lower cost of ownership. Like its predecessor, SICA108 performs surface inspection for detecting scratches, crystal defects, and particles on the wafer surface and PL inspection for detecting basal plane dislocations (BPD) inside Epi layers and stacking faults (SF), concurrently and with high sensitivity. It also features a high-accuracy defect classification capability based on proprietary deep learning algorithm to enable the early detection and analysis of killer defects. It is also compatible with various automation systems used in smart fabs, such as automatic guided vehicles (AGV) and overhead hoist transports (OHT). Lasertec will continue to pursue the development of defect inspection technologies to address customer needs and contribute to the improvement of power device quality and productivity. Features: Concurrent inspection of surface defects and BPD/SF at high speed and with high sensitivity. Detailed classification of various defect types using high-accuracy Automatic Defect Classification (ADC) and high-resolution review images. Compatible with various automation systems, including AGV and OHT. Applications: Incoming and outgoing inspection of SiC bare wafers and SiC Epi wafers. Monitoring of SiC epitaxial growth processes. Monitoring of SiC polishing processes. Management of SiC device manufacturing processes.

Lasertec Corporation announced Resignation of Members of the Board of Directors (effective at closing of the Ordinary General Meeting of Shareholders on September 26, 2024): Koichi Moriizumi -Director and Senior Managing Executive Officer; Yutaro Misawa -Director and xecutive Officer; Kunio Kamide -Outside Director. Resignation of a Member of the Audit and Supervisory Board (effective at closing of the Ordinary General Meeting of Shareholders on September 26, 2024): Miyuki Ishiguro- Outside Audit & Supervisory Board Member.

Lasertec Corporation announced dividend for the fiscal year ended June 30, 2024 and provided dividend Guidance for the end of second quarter and full year of fiscal year ending June 30, 2025. For the year ended June 30, 2024, the company announced dividend of JPY 157.00 per share against JPY 128.00 per share a year ago. Payable on September 27, 2024. For the end of second quarter of fiscal year ending June 30, 2025, the company expects dividend of JPY 115.00 per share against JPY 73.00 per share a year ago. For the full year of fiscal year ending June 30, 2025, the company expects dividend of JPY 173.00 per share against JPY 157.00 per share a year ago.

Lasertec Corporation provided consolidated earnings guidance for the year ending June 30, 2025. For the year, the company expects net sales of JPY 240,000 million; operating income of JPY 104,000 million; Net income attributable to owners of parents of 74,000 million and net income per share of JPY 820.52.