Corporate Events

Advantest Corporation, Board Meeting, Sep 30, 2026. Agenda: To consider Disposal of Treasury Stocks based on the Post-issued Restricted Stock Unit Plan.

The company closed its plan on August 19, 2026.

From July 1, 2026 to August 19, 2026, the company has repurchased 2,144,200 shares, representing 0.3% for ¥63,579.86 million. With this, the company has completed the repurchase of 5,759,000 shares, representing 0.79% for ¥149,996.72 million under the buyback announced on October 28, 2025.

Advantest Corporation Presents at OCP APAC Summit 2026, Aug-11-2026 through Aug-12-2026. Venue: TaiNEX 2, Taipei City, Taiwan. Presentation Date & Speakers: Aug-11-2026, Kotaro Hasegawa.

Open Compute Project Foundation, OCP APAC Summit 2026, Aug 11, 2026 through Aug 12, 2026. Venue: TaiNEX 2, Taipei City, Taiwan.

Advantest Corporation Presents at Future of Memory and Storage (FMS) 2026, Aug-04-2026 . Venue: Santa Clara Convention Center & Hyatt Regency, Santa Clara, California, United States. Speakers: Marilyn Kushnick Goodman, Engineer.

Advantest Corporation, Board Meeting, Jul 31, 2026. Agenda: To consider the Disposal of Treasury Stocks as Restricted Stock.

Advantest Corporation revised consolidated earnings guidance for the year ending March 31, 2027. For the year, the company expects the net sales to be JPY 1,714,000 million, operating income to be JPY 846,000 million, net income of JPY 660,000 million or basic earnings per share to be JPY 911.64 compared to previous guidance of net sales to be JPY 1,420,000 million, operating income to be JPY 627,500 million, net income of JPY 465,500 million. basic earnings per share to be JPY 641.61. Reasons for Revisions: In CY2026, the semiconductor market is expected to surpass USD 1 trillion, with AI-related semiconductors continuing to drive growth. Also expect the semiconductor tester market to reach its largest-ever size, driven by rising production volumes and increasing complexity of AI-related semiconductors. In particular, test demand for inference AI semiconductors is expected to significantly exceed Advantest s projections as of April 2026.

Advantest Corporation announced the expansion of its SiConic ecosystem into a new Design-for-Test (DFT) Engineering environment. Comprising comprehensive bench-level DFT execution and debug functionality, this new environment enables DFT engineers to develop, validate and optimize test content in a production-aligned workflow before deployment to manufacturing. Advanced-node systems-on-chip (SoCs), AI accelerators and chiplet-based architectures are driving larger pattern volumes and more sophisticated DFT methodologies, contributing to growing semiconductor device complexity. Built on the SiConic platform, the DFT Engineering environment combines the new SiConic D200 digital instrument with SiConic Explorer, SiConic Script, and SiConic Link to provide a unified workflow for DFT pattern execution, debug, automation and validation on the bench. Engineers can generate, execute, iterate and validate DFT content using the same file formats, semantics and execution behavior employed on Advantest’s V93000 automated test platform. Traditionally, DFT engineers have relied on custom-built bench environments with limited correlation to production test systems or have depended on access to production ATE resources for validation. These approaches slow development cycles, create organizational bottlenecks and increase risk during transfer to manufacturing. By providing a V93000-compatible environment on the bench, SiConic enables DFT engineers to work independently while maintaining alignment with downstream production test workflows. The result is faster iteration, improved collaboration between DFT and test engineering teams, reduced dependence on ATE availability and greater confidence when transferring content to production. Within the DFT Engineering environment, SiConic Explorer’s software-defined workflow provides a DFT-centric user interface for pattern execution, debug and visualization of results, while SiConic Script enables automation and scripting of DFT workflows, allowing engineers to build repeatable debug, sweep, and validation flows. Together, these tools help streamline development and improve productivity across engineering teams. From a hardware perspective, the solution supports seamless transfer of validated content to the V93000 platform, helping reduce rework and improve first-pass success in production. The new SiConic D200 digital instrument is the key execution enabler, delivering production-aligned digital execution capabilities with data rates of up to 200 Mbps and support for low-jitter clock sources. The DFT Engineering solution further expands the reach of the SiConic ecosystem, introduced in early 2025, to provide a unified, automated and scalable environment for silicon validation and bench engineering. With this latest addition, SiConic now supports multiple user communities—including design verification, test engineering and DFT engineering—while maintaining tight integration with Advantest's production test platforms. Together, these solutions create a continuous workflow that enables test content to be developed and validated earlier while ensuring smooth transfer into high-volume manufacturing. The SiConic DFT Engineering will be available by the end of September 2026. Advantest will showcase the full solution at ITC India, July 19-21, in booth #18.

Advantest Corporation, Q1 2027 Earnings Call, Jul 29, 2026

From April 1, 2026 to June 30, 2026, the company has repurchased 1,566,100 shares, representing 0.22% for ¥18,736.66 million. With this, the company has completed the repurchase of 3,614,800 shares, representing 0.5% for ¥86,416.86 million under the buyback announced on October 28, 2025.

Advantest Corporation and OpenLight announced their plans to partner and develop solutions for scalable, high-volume silicon photonics testing. Advantest will work with OpenLight to address the unique challenges of high-volume electro-optical device testing. Through this collaboration, Advantest Corporation and OpenLight aim to establish an end-to-end test solution for high-volume manufacturing, enabling scalable production of next-generation silicon photonics devices and accelerating the adoption of optical interconnect technologies for data centers and high-speed networking applications.

Advantest Corporation announced that they will report Q1, 2027 results at 9:00 AM, Tokyo Standard Time on Jul 29, 2026

Advantest Corporation expected to report Q1 2027 results on July 28, 2026. This event was calculated by S&P Global (Created on June 14, 2026).

Advantest Corporation Presents at ISIG Executive Summit EU, Sep-15-2026 . Venue: Prague, Czech Republic.

International Semiconductor Industry Group Ltd, ISIG Executive Summit EU, Sep 15, 2026 through Sep 16, 2026. Venue: Prague, Czech Republic.

Advantest Corporation announced the year-end dividend of JPY 30.00 per share for the fiscal year ended March 31, 2026, payable on June 2, 2026 against JPY 20.00 per share a year ago. Record date on March 31, 2026. Total amount of dividends JPY 21,765 million. Source of dividends from Retained earnings. Reasons for Determination of Year-End Dividends: The shareholder return policy of Advantest has set a target to achieve a cumulative total return ratio of 50% or more over the three years of the third mid-term management plan with a minimum dividend of JPY 30.00 per share for annual. Based on this policy and the result of the consolidated financials for the fiscal year ended March 31, 2026, we set the year-end dividend to JPY 30.00 per share.

Advantest Corporation reported earnings results for the full year ended March 31, 2026. For the full year, the company reported sales was JPY 1,128,610 million compared to JPY 779,707 million a year ago. Net income was JPY 375,353 million compared to JPY 161,177 million a year ago. Basic earnings per share from continuing operations was JPY 515.15 compared to JPY 218.67 a year ago. Diluted earnings per share from continuing operations was JPY 513.3 compared to JPY 218.01 a year ago.

Advantest Corporation, Annual General Meeting, Jul 31, 2026.

Advantest Corporation, Board Meeting, Apr 27, 2026. Agenda: To consider and approve the disposal of Treasury Stock as Restricted Stock.

Advantest Corporation, Board Meeting, Apr 01, 2026.

Advantest Corporation announced Pin Scale 5000B, an enhanced digital test solution for the V93000 EXA Scale Platform designed to address the growing test requirements of advanced artificial intelligence (AI) and high-performance computing (HPC) devices. AI and HPC semiconductor capabilities and complexity are growing swiftly, driven by advanced process nodes, heterogeneous integration and chiplet-based architectures. These devices require significantly higher structural and functional test coverage and processing of rapidly increasing volumes of test data. The Pin Scale 5000B card significantly expands available vector memory, offering deep and scalable storage capacity aligned with industry demands. Hardware and software facilitate optimal memory usage in chiplet-based architectures, reducing customers’ overall consumption and associated costs while addressing evolving memory requirements for the future. The new card also enables customers to efficiently scale their existing test programs and hardware configurations in response to evolving device requirements. This solution is engineered to accommodate contemporary scan fabric architectures, enabling concurrent testing of multiple IP cores using a streaming approach. Its new hardware capabilities allow test results to be observed across multiple cores within a single test pattern execution, enabling instantaneous insights into error distribution among the cores. These capabilities help improve structural coverage and core-level visibility, significantly reducing test times and cost-of-test. The Pin Scale 5000B delivers high-bandwidth test access, offering data rates up to 5 Gbps through the proven pin electronics architecture of the Pin Scale 5000. Pin Scale 5000B is a fully compatible superset of the established Pin Scale 5000, complementing the V93000 portfolio. The Pin Scale 5000B digital test instrument is now ramping with key customers.

Advantest Corporation has announced a Fixed-Income Offering. Security Name: Zero Coupon Bonds Due 2031 Security Type: Corporate Bond/Note (Convertible) Principal Amount: ¥100 billion Security Features: Convertible; Zero Coupon Coupon Type: Zero

Advantest Corporation Presents at International Semiconductor Industry Group (ISIG) Symposium 2026, Apr-21-2026 11:15 AM. Venue: Sunnyvale, California, United States. Speakers: Richard Lathrop, VP SOC Business Development.

International Semiconductor Industry Group Ltd, International Semiconductor Industry Group (ISIG) Symposium 2026, Apr 20, 2026 through Apr 21, 2026. Venue: Sunnyvale, California, United States.

Advantest Corporation announced the opening of two Advantest Innovation Centers—one located on the company’s campus in San Jose, Calif., and another currently under construction in nearby Sunnyvale, Calif. The Advantest Innovation Center is a first-of-its-kind space offering laboratories and advanced test equipment. The facilities are designed to enable deep collaboration with partners across the semiconductor value chain, accelerating the development of innovative test solutions for next-generation semiconductor technologies. The Advantest Innovation Centers provide a unique environment to support this collaboration, featuring equipment, clean rooms and the latest test technologies and test insertions for advanced packaging and complex device architectures. Strategically located in Silicon Valley, these facilities offer a central hub for hands-on innovation, enabling the company’s partners to work side by side with Advantest’s team of experts to develop innovative solutions that optimize reliability and improve productivity. Partnering early in the development process allows participants to build informed, long-term roadmaps and align R&D efforts to address industry challenges from the outset. Through these collaborations, the Advantest Innovation Centers will help deliver test solutions that innovate workflows to support the needs of customers in high-performance computing, edge AI, and other emerging markets worldwide. The Advantest Innovation Center located in San Jose is open, while the Sunnyvale location is planned to open later this summer. Partnerships have already been initiated with manufacturers and suppliers.

Advantest Corporation Presents at AServer/Cloud Computing/AI Forum, May-13-2026 . Venue: San Jose, California, United States.

JEDEC Solid State Technology Association, aServer/Cloud Computing/AI Forum, May 13, 2026. Venue: San Jose, California, United States.

Advantest Corporation Presents at AMobile/Client/Edge Forum, May-12-2026 . Venue: San Jose, California, United States.

JEDEC Solid State Technology Association, aMobile/Client/Edge Forum, May 12, 2026. Venue: San Jose, California, United States.

Terrapinn Holdings Ltd, Future of Memory and Storage (FMS) 2026, Aug 04, 2026 through Aug 06, 2026. Venue: Santa Clara Convention Center & Hyatt Regency, Santa Clara, California, United States.

Advantest Corporation, 2026 Earnings Call, Apr 27, 2026

From January 1, 2026 to March 31, 2026, the company has repurchased 871,800 shares, representing 0.12% for ¥44,228.37 million. With this, the company has completed the repurchase of 2,048,700 shares, representing 0.28% for ¥67,680.2 million under the buyback announced on October 28, 2025.

Advantest Corporation, Board Meeting, Mar 31, 2026. Agenda: To consider and approve the Disposal of Treasury Stocks as Restricted Stock.

Advantest Corporation Presents at SEMICON China 2026, Mar-22-2026 through Mar-27-2026. Venue: Shanghai New International Expo Centre, Shanghai, China. Presentation Date & Speakers: Mar-22-2026, Bank Liu, Chelsea Zhou, Fangmin Chu, Ya Gao. Mar-23-2026, Bank Liu, Daniel Sun, Dong Hao, Felix Chen, Haijing Wu, Kaitao Liu, Kevin YAN, Liuhao Chen, Norris Wang, Qingchuan Ma, Qinghua Qi, Rong Tang, Ruiqiang Liu, Xiao Li, Xiaoxiao Wei, Yaqiong Mao, Ying He, Zhenyan Cao.

Advantest Corporation, ¥ 29.0, Cash Dividend, Mar-30-2026

Advantest Corporation announced that they will report fiscal year 2026 results at 3:30 PM, Tokyo Standard Time on Apr 27, 2026

Advantest Corporation Presents at Chiplet Summit 2026, Feb-17-2026 08:30 AM. Venue: Santa Clara Convention Center, Santa Clara, California, United States. Speakers: Andreas Harder.

Advantest Corporation reported earnings results for the nine months ended December 31, 2025. For the nine months, the company reported sales was JPY 800,537 million compared to JPY 547,358 million a year ago. Net income was JPY 248,526 million compared to JPY 121,210 million a year ago. Basic earnings per share from continuing operations was JPY 340.6 compared to JPY 164.21 a year ago. Diluted earnings per share from continuing operations was JPY 339.45 compared to JPY 163.72 a year ago.

Advantest Corporation revised consolidated earnings guidance for the year ending March 31, 2026. For the year, the company expects the net sales to be JPY 1,070,000 million, operating income to be JPY 454,000 million, net income of JPY 328,500 million, net income attributable to owners of the parent to be JPY 328,500 million or basic earnings per share to be JPY 452.34 against net sales to be JPY 950.0 billion, operating income to be JPY 374.0 billion, net income of JPY 275.0 billion.

Advantest Corporation, Board Meeting, Jan 28, 2026. Agenda: To consider Regarding Cancellation of Treasury Shares.

Advantest Corporation, Q3 2026 Earnings Call, Jan 28, 2026

Advantest Corporation expected to report Fiscal Year 2026 results on April 24, 2026. This event was calculated by S&P Global (Created on January 7, 2026).

From October 28, 2025 to December 31, 2025, the company has repurchased 1,176,900 shares, representing 0.16% for ¥23,451.83 million. With this, the company has completed the repurchase of 1,176,900 shares, representing 0.16% for ¥23,451.83 million under the buyback announced on October 28, 2025.

Advantest Corporation, Board Meeting, Dec 18, 2025. Agenda: To dispose treasury stocks based on the post-issued restricted stock unit.

Advantest Corporation and Tokyo Seimitsu Co., Ltd. announced plans to co-develop a new die-level prober, designed for the testing of high-performance computing (HPC) devices. Semiconductors are expected to become increasingly advanced and complex in the coming years. To promptly meet evolving market needs and deliver high-performance total test solutions to customers, close collaboration across the semiconductor value chain is essential. Advantest and Tokyo Seimitsu will jointly develop die-level prober, leveraging their respective expertise to deliver advanced probing capabilities essential for testing AI and high-performance computing (H PC) devices. AI and high-performance computing ("HPC") devices, such as GPUs and CPUs used in servers, require extremely high computational performance for AI model training, inference and execution. These devices often employ advanced 2.5D/3D packaging technologies, which generate significant heat during massive data processing. As a result, controlling temperature during test is a major challenge. Through this collaboration, the two companies will strengthen next-generation probing and handling technologies to address these challenges and contribute to the growth of the AI/HPC market.

Advantest Corporation Presents at SEMICON Japan 2025, Dec-17-2025 . Venue: Tokyo Big Sight 3 Chome-11-1 Ariake, Koto City, Tokyo, Japan.

Advantest Corporation announced that they will report Q3, 2026 results on Jan 28, 2026

Advantest Corporation announced the T2000 AiR2X, a next-generation air-cooled test system engineered to meet rising demand for compact, cost-efficient testers in evaluation and high-mix, low-volume production environments. The new solution is fully compatible with the conventional T2000 test system and delivers twice the test resources of the previous air-cooled T2000 AiR test system, while maintaining low power and air-cooling requirements. The T2000 AiR2X addresses multiple converging market factors, including end-of-life support for legacy systems such as the T6500 series and T7700 series, and ongoing replacement needs across compact air-cooled testers. With a multitude of air-cooled SoC test systems in operation worldwide, the new T2000 AiR2X solution positions Advantest to meet sustained demand in this growing market. With its flexible measurement configuration, the T2000AR2X supports up to 12 measurement modules, including functional/SCAN test, high-precision DC and automotive device DC testing up to 320V. The system's unique multisite controller function significantly reduces test time during volume production. The T2000 AiR 2X incorporates Advantest's T2000 RECT550 performance board, which flexibly supports a wide range of configurations, along with a unified support infrastructure and expandable module options, adopting the same program environment used in the T2000. In addition, the Rapid Development Kit (RDK) significantly reduces the effort required for program creation and debugging, contributing to shorter platform migration and implementation times. Initial device evaluations are underway, confirming broad application coverage for the T2000 AiR2 X across industrial MCUs, consumer ASICs, battery-monitoring ICs for automotive and mobile devices, and power analog applications. The system will enter general availability later this month.

Advantest Corporation announced the M5241 Memory Handler, its next-generation handler developed to meet the performance, automation and cost-efficiency demands of emerging high-performance memory devices--particularly those used in artificial intelligence (AI) applications. First shipments of the new handler are scheduled for second quarter of calendar year 2026. Engineered as the next evolution of Advantest's memory test cell strategy, the M5241 utilizes vertical docking to integrate seamlessly with the company's latest T5801 ultra-high-speed DRAM tester and offers docking compatibility with existing testers, including the T5833, T5503HS2, and T5835, enabling customers to fully leverage their installed base. The handler's new temperature-control architecture--combined with optional active thermal control--delivers accurate, stable testing for advanced memory ICs, including those with significant self-heating, directly improving yield and reliability for customers' devices. The M5241 was developed in response to rapid growth in demand for high-bandwidth and high-capacity memory used in AI and data-center applications. The new handler strengthens Advantest's market-leading position while supporting customers' need for higher throughput, lower costs, and improved operational visibility. The new handler has already undergone internal evaluation with actual memory ICs in combination with the T5801 tester, completing validation under mass-production conditions. Multiple major memory manufacturers are preparing for adoption. The M5241 handler supports DDR5, next-gen DRAM, NAND, AI memory and other high-density memories. It features up to 512 parallel test sites with a maximum throughput of 46,000 units per hour and can accommodate temperature ranges from -40degC to +125degC (standard) or -55degC to +150degC (extended). Key benefits of the new handler include: High-precision temperature control: A new microchamber and optional active thermal control maintain stable device temperatures even under heavy self-heating loads, enabling accurate test conditions and improved yield. Enhanced maintainability and lower cost of ownership: Features such as automatic origin search and a seamless one-touch change kit shorten maintenance operations--taking a fourth of the time compared to prior workflows--red reducing downtime and operational costs. Automation-readiness for modern fabs: Compatibility with standard in-fab overhead transport and robotic systems, plus optional HM360 software, supports advanced automation, data visualization, and predictive maintenance.

SEMI, SEMICON China 2026, Mar 22, 2026 through Mar 27, 2026. Venue: Shanghai New International Expo Centre,, Shanghai, China.

Semper Technologies, Chiplet Summit 2026, Feb 17, 2026 through Feb 19, 2026. Venue: Santa Clara Convention Center, Santa Clara, California, United States.

Advantest Corporation reported earnings results for the half year ended September 30, 2025. For the half year, the company reported sales was JPY 526,733 million compared to JPY 329,206 million a year ago. Net income was JPY 169,813 million compared to JPY 69,343 million a year ago. Basic earnings per share from continuing operations was JPY 232.19 compared to JPY 93.92 a year ago. Diluted earnings per share from continuing operations was JPY 231.49 compared to JPY 93.64 a year ago.

Advantest Corporation Presents at SEMICON EUROPA 2025, Nov-18-2025 . Venue: Messe München, Munich, Germany.

Advantest Corporation Presents at Advanced Packaging Conference, Nov-19-2025 04:20 PM. Venue: ICM Munich, Munich, Germany. Speakers: Fabio Pizza, business segment manager, Advantest Europe.

SEMI, Advanced Packaging Conference, Nov 19, 2025. Venue: ICM Munich, Munich, Germany.

Advantest's IR Fireside Chat Q&A

Advantest Corporation announced the MTe power test platform. The cutting-edge MTe redefines test efficiency and scalability to address test requirements for the fast-growing power semiconductor market. Increasing market demand for electrification across automotive, industrial, renewable energy, telecommunication and data infrastructure applications is pushing semiconductor manufacturers to achieve higher performance and lower cost of test (CoT). The MTe platform responds to these needs by combining modular hardware architecture, ultimate system scalability and advanced digital control, redefining the standard in power semiconductor test performance and efficiency. Designed with Advantest technology, MTe provides significant footprint reduction and optimized resource distribution without performance degradation--a key enabler to attract major IDM and OSAT players. The MTe platform is able to address emerging wide-bandgap semiconductor (e.g., SiC and GaN) challenges, as well as the integration of digital IP cores on power devices (e.g., IPM and IPD), providing high bandwidth capture, best-in-class gate driver control, dynamic (and short-circuit) test up to 10kA, and flexible high-voltage digital capabilities. Aligned with Advantest's history of providing scalable test platforms, MTe distributed computing architecture provides significant multisite test efficiency, enabling a high-parallel-test solution with optimized throughput. The MTe platform is now available worldwide. Early evaluations by customers in automotive and industrial power applications have confirmed significant productivity and throughput gains compared with legacy testers.

Advantest Corporation announced that the Board of Directors resolved to make the interim dividends for the fiscal year ending March 31, 2026 of JPY 29.00 per share as compared to JPY 19 per share paid a year ago. Record date is September 30, 2025. Effective date is December 1, 2025.

Advantest Corporation revised consolidated earnings guidance for the year ending March 31, 2026. For the year the company now expects the Net Sales of JPY 950,000 million, Operating income of JPY 374,000 million, Net income of JPY 275,000 million, Basic earnings per share of JPY 378.06 as compared to previous guidance of Net Sales of JPY 835,000 million, Operating income of JPY 300,000 million, Net income of JPY 221,500 million, Basic earnings per share of JPY 302.71. In CY2025, the semiconductor industry growth is likely to continue to be driven by AI-related semiconductors. In the semiconductor tester industry, tester demand is expected to exceed the previous year’s level, driven by factors such as the increasing complexity and enhanced performance, as well as rising production volumes of AI-related semiconductors. Based on this outlook and the progress made for the six-month period ended September 30, 2025, Advantest has revised its full-year consolidated earnings forecast for the current fiscal year as shown above. .

Advantest Corporation expected to report Q3 2026 results on January 28, 2026. This event was calculated by S&P Global (Created on October 28, 2025).

Advantest Corporation (TSE:6857) announces a share repurchase program. Under the program, the company will repurchase up to 18,000,000 shares, representing 2.47% of outstanding shares for ¥150,000 million. The company will repurchase its shares for the purpose of shareholder returns and for improving capital efficiency. The program will expire on October 28, 2026. As of September 30, 2025, the company had 727,392,176 shares in outstanding and 38,749,080 shares in treasury.

The Board of Directors of Advantest Corporation has authorized a buyback plan on October 28, 2025.

Advantest Corporation, Board Meeting, Oct 28, 2025. Agenda: To consider regarding Disposal of Treasury Stock based on the Post-issued Restricted Stock Unit Plan.

Advantest Corporation, VOICE 2026 Developer Conference, May 18, 2026 through May 20, 2026. Venue: Scottsdale, Arizona, United States.