Corporate Events

Taiyo Holdings Co., Ltd. presented a paper on September 10, 2026, at the 11th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2026), held in Helsinki, Finland, on the 'FPIM Series,' a next-generation semiconductor-packaging material. The FPIM Series is a fine-pitch RDL negative-tone i-line photosensitive insulating material for dual damascene processes. This paper was co-authored with imec, one of the world's largest semiconductor research institutes. The RDL is a key technology in advanced semiconductor-packaging structures, enabling more efficient electrical connections. Currently, RDLs are manufactured mainly using the semi-additive process (SAP). According to imec, as the industry pursues increasingly fine-pitch wiring, the dual damascene process will become essential for forming wiring with pitches of 1.6 micrometers or less. To address this, Taiyo Holdings developed the Material as a next-generation fine-pitch RDL material for dual damascene processes and began joint research with imec in October 2022. In November 2025, the two organizations presented a co-authored paper on the formation of a three-layer RDL structure with a CD of 1.6 micrometers on 12-inch wafers. In this research, a three-layer RDL structure was formed on 12-inch wafers using the Material and evaluated. As a result, the target dimension of 700-nm CD was achieved for both interconnects and vias. The 700-nm CD metal 1 layer (M1) also demonstrated favorable electrical characteristics in terms of leakage current and resistance. Through this joint research with imec, it was confirmed that the Material offers excellent electrical characteristics and high resolution and is suitable for use with the CMP process. These results represent an important achievement in interconnect technology for next-generation advanced packaging, paving the way for the future development of submicron-class RDL design rules. Taiyo Holdings aims to achieve RDL formation with a CD of 500 nm or less on wafers, while continuing to verify the long-term performance and reliability of the electrical characteristics. The company will continue developing materials that contribute to the growth of the semiconductor packaging field, such as by enabling further improvements in the performance of AI semiconductors. Taiyo Holdings also began shipping small-volume samples of the Material for R&D applications in 2025. RDL (redistribution layer) is a layer formed on the surface of a semiconductor chip to redistribute electrical wiring. A method in which a thin seed layer is formed over the entire surface, followed by electroplating to form wiring patterns in designated areas. A method in which wiring trenches are formed in an insulating film and then filled by sputtering, CVD, electroplating, or similar methods to form wiring patterns. CD (critical dimension) refers to the dimensions of fine patterns. The CMP process (chemical mechanical planarization/polishing) is a semiconductor-manufacturing process that chemically and mechanically planarizes the wafer surface. Headquartered in Belgium, imec is one of the world's leading research and innovation hubs for advanced semiconductor technology. It promotes open innovation in collaboration with universities and companies around the world, contributing to the development of cutting-edge semiconductor technologies. In October 2022, imec and Taiyo Holdings began joint research on a fine-pitch RDL negative-tone photosensitive insulating material for damascene processes, a material for next-generation semiconductor packaging. Since November 2024, Taiyo Holdings has also dispatched personnel to be stationed at imec to facilitate closer collaboration, while conducting ongoing research and development of advanced semiconductor materials. In November 2025, the two organizations announced that they had achieved a wiring CD of 1.6 micrometers and a via CD of 2 micrometers on 12-inch wafers using the 'FPIM Series' RDL material.

Taiyo Holdings Co., Ltd., Board Meeting, Sep 01, 2026. Agenda: To consider Regarding Sale of Investment Securities and Expected Recognition of Extraordinary Income.

Taiyo Holdings Co., Ltd. announced that it has resolved to change the organization and personnel as follows at the Board of Directors meeting held on July 31, 2026. 1. Organizational changes: In order to review the management structure of Taiyo Holdings, the company will change a part of the organization as follows. (1) Details and reasons for the changes: Internal Audit Department: A. Details of the change: The Internal Audit Department will be transferred from under the business execution divisions to directly under the President. B. Reason: To enhance the independence and objectivity of the internal audit function. Risk and Compliance Department: A. Details of the change: A new Risk and Compliance Department will be established. B. Reason: To strengthen the Group's overall risk management and compliance framework by establishing a dedicated, permanent organization with overarching responsibility for risk and compliance. (2) Timing of organizational changes: September 1, 2026.

Taiyo Holdings Co., Ltd. revised consolidated earnings guidance for the six months ending September 30, 2026 and full Fiscal year ending March 31, 2027. For the six months period, the company expects net sales to be JPY 75,900 million, operating income to be JPY 18,900 million, profit attributable to owners of parent to be JPY 13,100 million, and basic earnings per share to be JPY 117.73 against net sales to be JPY 73,100 million, operating income to be JPY 16,800 million, profit attributable to owners of parent to be JPY 11,800 million, and basic earnings per share to be JPY 106.11 expected previously. For the full year, the company expects net sales to be JPY 149,100 million, operating income to be JPY 36,400 million, profit attributable to owners of parent to be JPY 25,400 million, and basic earnings per share to be JPY 228.26 against net sales to be JPY 146,300 million, operating income to be JPY 34,300 million, profit attributable to owners of parent to be JPY 24,100 million, and basic earnings per share to be JPY 216.72 expected previously. Reasons for revision: The performance of the Electronics business in the first quarter outperformed the forecast due to a weaker than expected yen and higher than expected demand for rigid board materials for China. Based on the results for the first quarter, the Company has maintained its earnings forecasts for the second quarter and beyond as they were in the earnings forecasts it disclosed on April 30, 2026. Nevertheless, it has replaced its earnings forecasts for the first quarter in the Electronics business with the actual results. Furthermore, in light of recording special employee benefit expenses as an extraordinary loss in the first quarter, the Company has revised its consolidated earnings forecasts for the second quarter (cumulative) and the full fiscal year. The forecasts for the "Medical and Pharmaceuticals" and "ICT and Sustainability" businesses have not been revised.

Taiyo Holdings Co., Ltd., Board Meeting, Jun 29, 2026. Agenda: To Notice Regarding Personnel Changes.

Taiyo Holdings Co., Ltd. resolved at the Board of Directors meeting held on June 20, 2026 to change personnel. Taro Onishi was appointed as Senior Managing Executive Officer, Chief Strategy Officer of Electronics Company, President of Taiyo Ink (Suzhou) Co., Ltd., President of Taiyo Ink International (HK) Limited, President of Taiyo Ink Trading (Shenzhen) Co., Ltd., Board Director of Taiwan Taiyo Ink Co., Ltd., Board Director of Taiyo Ink International (Singapore) Pte Ltd., Board Director of Onstatic Technology Co., Ltd., Board Director of Taiyo Trading (Thailand) Co., Ltd., Board Director of Taiyo Ink Vietnam Co., Ltd., Board Director of Onstatic New Material (JiangXi) Co., Ltd., and President of TBF Semiconductor Material (Shenzhen) Co., Ltd. Taro Onishi previously served as Senior Managing Executive Officer, President of Taiyo Ink (Suzhou) Co., Ltd., President of Taiyo Ink International (HK) Limited, President of Taiyo Ink Trading (Shenzhen) Co., Ltd., Board Director of Onstatic New Material (JiangXi) Co., Ltd., and President of TBF Semiconductor Material (Shenzhen) Co., Ltd. Hidekazu Miyabe was appointed as Managing Executive Officer, Chief Technology Officer of Electronics Company, Vice President of Taiyo Ink Mfg. Co., Ltd., and Board Director of Taiyo Fine Chemicals Co., Ltd. Hidekazu Miyabe previously served as Managing Executive Officer, Board Director of Taiyo Ink Mfg. Co., Ltd., and Board Director of Taiyo Fine Chemicals Co., Ltd. The change was disclosed on April 30, 2026. Masao Arima was appointed as Managing Executive Officer and President and Representative Director of mystarz Co., Ltd. Masao Arima previously served as Managing Executive Officer, CBDO of Medical & Pharmaceutical Company, Board Director of Taiyo Fine Chemicals Co., Ltd., and President and Representative Director of mystarz Co., Ltd.

Taiyo Holdings Co., Ltd. announced that it had determined Chairman of the Board of Directors as follows at the Board of Directors meeting held on June 20, 2026. Hitoshi Saito was appointed as Chairman of the Board of Directors, effective June 20, 2026. Hitoshi Saito was born on April 21, 1965. His career history is as follows: Marketing Manager of Win System Inc. (Win System Europe) (November 1995), joined Taiyo Holdings (September 1996), Managing Director of TAIYO INK INTERNATIONAL (SINGAPORE) PTE LTD (June 2001), General Manager/Director of TAIYO INK (THAILAND) CO., LTD. (July 2001), Director of International Business Department of Taiyo Holdings (July 2010), Director of TAIYO INK MFG. CO., LTD. (June 2012, present post), President and CEO of TAIYO INK PRODUCTS CO., LTD. (April 2015), President and CEO of TAIYO INK MFG. CO., (KOREA) LTD. (May 2016), Board Director of Taiyo Holdings (June 2016), Board Director and Senior Executive Officer of Taiyo Holdings (July 2016), Director of TAIYO AMERICA, INC. (April 2019, present post), Director of TAIYO INK INTERNATIONAL (SINGAPORE) PTE LTD (October 2019, present post*), Director of TAIYO TRADING (THAILAND) CO., LTD. (February 2020, present post*), Chairman and CEO of TAIYO INK MFG. CO., (KOREA) LTD. (April 2020), Chairman and CEO of TAIYO INK PRODUCTS CO., LTD. (April 2020), Chairman of the Board of TAIWAN TAIYO INK CO., LTD. (May 2020, present post), Director of ONSTATIC New Material (JiangXi) Co., Ltd. (May 2020, present post*), Director of TAIYO CIRCUIT AUTOMATION, INC. (June 2020, present post), Chairman of TAIYO INK VIETNAM CO., LTD. (June 2020, present post*), Chairman of the Board of ONSTATIC TECHNOLOGY CO., LTD. (October 2021, present post), Chairman of the Board of TAIYO INK (SUZHOU) CO., LTD. (December 2021), Chairman of the Board of ONSTATIC INK (SHENZHEN) CO., LTD. (December 2021), Director of TAIYO INK MFG. CO., (KOREA) LTD. (January 2022, present post*), Director of TAIYO INK PRODUCTS CO., LTD. (January 2022, present post), CEO of Electronics Company of Taiyo Holdings (May 2022), Vice President and Representative Director of Taiyo Holdings (June 2022), Chairman of the Board of TBF Semiconductor Material (Shenzhen) Co., Ltd. (April 2025, present post), Chairman of the board of TAIYO INK TRADING (SHENZHEN) CO., LTD. (April 2025), President, Group Chief Executive Officer, Officer (Risk Management) and in charge of Research Division of Taiyo Holdings (June 2025, present post), Director of TAIYO INK (SUZHOU) CO., LTD. (October 2025, present post), Director of TAIYO INK TRADING (SHENZHEN) CO., LTD. (October 2025, present post). *Scheduled to retire in June 2026.

Taiyo Holdings Co., Ltd., Board Meeting, Jun 20, 2026. Agenda: To consider and approve announces that it has determined Chairman of the Board of Directors; and to consider and approve other business related matters.

Taiyo Holdings Co., Ltd. announced that they will report Q1, 2027 results on Jul 31, 2026

Taiyo Holdings Co., Ltd. expected to report Q1 2027 results on August 4, 2026. This event was calculated by S&P Global (Created on May 17, 2026).

Taiyo Holdings Co., Ltd., Board Meeting, May 14, 2026. Agenda: To consider the Notice Regarding Personnel Changes.

Taiyo Holdings Co., Ltd. reported earnings results for the full year ended March 31, 2026. For the full year, the company reported sales was JPY 137,851 million compared to JPY 119,010 million a year ago. Net income was JPY 24,011 million compared to JPY 10,780 million a year ago. Basic earnings per share from continuing operations was JPY 215.92 compared to JPY 96.59 a year ago.

Taiyo Holdings Co., Ltd., Board Meeting, Apr 30, 2026. Agenda: To consider changes in the Responsibilities of the Board Director.

Taiyo Holdings Co., Ltd., Annual General Meeting, Jun 20, 2026.

Taiyo Holdings Co., Ltd. announced that they will report fiscal year 2026 results on Apr 30, 2026

Taiyo Holdings Co., Ltd. announced that, at the meeting of its Board of Directors held on March 31, 2026, it has resolved to revise its dividend forecast for the fiscal year ended March 31, 2026, which was previously announced on November 6, 2025, and not to pay a year-end dividend for that fiscal year compared to previous guidance of JPY 72.50 per share. Reasons for revision: At a meeting of the Board of Directors, Taiyo Holdings resolved, as its current position concerning the Tender Offer, that if the Tender Offer is commenced, it will express its position in support of the Tender Offer and leave the decision of whether or not to tender to the Tender Offer to its shareholders. The above resolution of the Board of Directors was made on the assumption that the Offeror intends to privatize the Company Shares through a series of transactions including the Tender Offer that are aimed at making the Company Shares private, and that the Company Shares are scheduled to be delisted. Taiyo Holdings regards cash returns to shareholders as one of its most important management policies. In line with its basic policy of providing a continuous and stable return of profits at a high level, it has set targets of adopting Dividend on Equity ratio (DOE) as a key indicator under its long-term management plan and maintaining a consolidated DOE of at least 5%, while also implementing shareholder returns with the aim of achieving a consolidated total payout ratio of 100% to improve ROE (at least by the fiscal year ending March 2028). However, according to the Offeror, the purchase price for the Tender Offer were determined on the assumption that no distribution of surplus with a record date of March 31, 2026 would be made. In light of this, at the meeting of the Board of Directors held today, Taiyo Holdings resolved, conditional upon the successful completion of the Tender Offer, to revise its dividend forecast for the fiscal year ended March 31, 2026 and not to pay a year-end dividend for that fiscal year.

KKR & Co. Inc. (NYSE:KKR) proposed to acquire Taiyo Holdings Co., Ltd. (TSE:4626) from KOWA Co., Ltd., DIC Corporation (TSE:4631), Oasis Management Company Ltd. and others for approximately ¥530 billion on March 31, 2026. A cash consideration valued at ¥4750 per share will be paid by KKR & Co. Inc. The transaction is subject to approval by regulatory board / committee.

Taiyo Holdings Co., Ltd., Board Meeting, Mar 31, 2026. Agenda: To consider and approve to revise its dividend forecast for the fiscal year ended March 2026.

Taiyo Holdings Co., Ltd. revised consolidated earnings guidance for the year ending March 31, 2026. For the year, the company expects net sales to be JPY 133,000 million. Operating income to be JPY 26,900 million. Profit attributable to owners of parent to be JPY 20,100 million. Basic earnings per share to be JPY 180.75 against previous guidance of net sales to be JPY 128,800 million. Operating income to be JPY 26,900 million. Profit attributable to owners of parent to be JPY 18,400 million. Basic earnings per share to be JPY 165.46. The performance of the Electronics business in the third quarter outperformed the forecast due to higher than expected demand for semiconductor package products (PKG) and rigid board materials for China. In light of this, the company therefore revised the consolidated earnings forecasts, leaving the earnings forecast for the fourth quarter at the level announced on November 6, 2025, replacing the Electronics business earnings forecast for the third quarter with the actual results.

Taiyo Holdings Co., Ltd. reported earnings results for the nine months ended December 31, 2025. For the nine months, the company reported sales was JPY 103,742 million compared to JPY 90,682 million a year ago. Net income was JPY 17,447 million compared to JPY 12,965 million a year ago. Basic earnings per share from continuing operations was JPY 156.93 compared to JPY 115.99 a year ago.

Taiyo Holdings Co., Ltd. expected to report Fiscal Year 2026 results on April 30, 2026. This event was calculated by S&P Global (Created on April 3, 2026).

Taiyo Holdings Co., Ltd., Board Meeting, Feb 04, 2026. Agenda: To discuss Regarding Personnel Changes.

Taiyo Holdings Co., Ltd. announces that, following the discovery of an inappropriate expense claim by Managing Executive Officer Naohiro Arata, Mr. Arata submitted his resignation as Managing Executive Officer, effective today, and that the Board of Directors has accepted his resignation. Date of resignation: December 19, 2025.

Taiyo Holdings Co., Ltd.(TSE:4626) added to S&P Japan 500

Taiyo Holdings Co., Ltd., Board Meeting, Dec 19, 2025. Agenda: To consider and approve the resignation of Executive Officer; and to consider and approve other business matters.

Taiyo Holdings Co., Ltd. announced that they will report Q3, 2026 results on Feb 04, 2026

Taiyo Holdings Co., Ltd. revised dividend guidance for the fiscal year ending March 31, 2026. For the year, the company expects to pay dividend of JPY 72.50 per share against JPY 150.00 per share paid a year ago and previous guidance of JPY 145.00 per share. If the stock split is not taken into account, year-end cash dividends (forecast) and total annual cash dividends (forecast) for the fiscal year 2026 are JPY 145.00 per share and JPY 310.00 per share, respectively. Reasons for the revision of the dividend forecast: Based on upward revision to the consolidated earnings forecast for the six months ended September 30, 2025, The company has decided to increase the interim dividend per share for the fiscal year ended March 31, 2026, by JPY 20.00 per share to JPY 165.00 per share. As of November 6, 2025, the fiscal year-end dividend forecast remains unchanged. The company will continue to consider flexible and responsive measures based on its shareholder returns policy, which targets a consolidated total payout ratio of 100% at least until the fiscal year ending March 31, 2028, while taking into consideration the possibility of revisions to full-year earnings forecast and other factors.

Taiyo Holdings Co., Ltd. revised Consolidated Earnings Guidance for the Year Ended March 31, 2026. For the year, the company expects net sales to be JPY 128,800 million. Operating income to be JPY 26,900 million. Profit attributable to owners of parent to be JPY 18,400 million. Basic earnings per share to be JPY 165.46.

Taiyo Holdings Co., Ltd. announced dividend for the second quarter Fiscal year-ending March 31, 2026 of JPY 165.00 per share as compared to JPY 40.00 per share paid a year ago. Scheduled date to commence dividend payments: December 1, 2025.

On November 13, 2025, Taiyo Holdings Co., Ltd. presented a paper, co-authored with imec at the 14th IEEE CPMT Symposium Japan (ICSJ2025), focusing on the "FPIM (TM) Series" (hereinafter referred to as " this material"), a negative-type photo sensitive insulating material for fine-pitch RDLs designed for the damascene process, developed as a next-generation semiconductor-packaging material. The RDL is an important technology in the most advanced structures of semiconductor packaging for more efficient electrical connections, and it is currently manufactured mainly by the semi-additive process (SAP) (2). The damascene process (3), imec suggests, will become essential for forming interconnections with line spacing of 1.6 micrometers or less in the future, as finer wiring is pursued. In response, Taiyo Holdings has been developing this material as a next-generation fine-pitch RDL material for the damascene process and has been conducting joint research with imec since October 2022. In this study, a three-layer RDL structure was formed on a 12-inch wafer using this material, and evaluations were carried out. Each wiring pitch achieved the target dimensions as follows: CD (4) 1.6 micrometers for the RDL1 layer on the wafer, CD 2.0 micrometers (with a via center-to-center pitch of CD 4.0 micrometers) for the via layer, and CD 1.6 micromers for the RDL2 layer. These values are extremely close to the resolution limit of the low NA stepper used in this study. In addition, the evaluation results of the electrical characteristics, specifically, leakage current and resistance, of the RDL1 layer with CD 1.6 micrometers were favorable. As an outcome of this joint research with imec, it was confirmed that this material possesses excellent electrical properties, high resolution, and quality suitable for adaptation to the CMP process. In the future, the company aims to achieve the formation of RDLs on wafers with a wiring pitch of CD 500 nm or less, while continuing to verify the long-term performance of electrical characteristics and reliability. Taiyo Holdings will continue developing materials that contribute to advances in the semiconductor-packaging field, including further performance enhancement of AI semiconductors. In addition, shipment of small-quantity samples of this material for R&D purposes began in 2025.

Taiyo Holdings Co., Ltd., 2 : 1, Stock Split or Significant Stock Dividend, Nov-27-2025

Taiyo Holdings Co., Ltd., ¥ 72.5, Cash Dividend, Mar-30-2026

Taiyo Holdings Co., Ltd. expected to report Q3 2026 results on February 5, 2026. This event was calculated by S&P Global (Created on November 6, 2025).

Taiyo Holdings Co., Ltd., Board Meeting, Nov 06, 2025. Agenda: To consider the Revised Full-year Earnings Forecasts; and to consider other matters.